An Introduction to Mixed-Signal Test and Measurement by Gordon Roberts, Friedrich Taenzler, Mark Burns

By Gordon Roberts, Friedrich Taenzler, Mark Burns

Built-in circuits incorporating either electronic and analog capabilities became more and more accepted within the semiconductor undefined. Mixed-signal IC attempt and dimension has grown right into a hugely really expert box of electric engineering. besides the fact that, try out engineering continues to be a comparatively unknown occupation in comparison to IC layout engineering.

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19. , for each $1 worth of devices shipped to the customer, the company makes a profit of 20 cents). 18? 80, how many devices does this represent? What obvious conclusion can we draw about the importance of test time reduction versus the importance of selling and shipping additional devices? References 1. , Boston,MA 02118 2. Miron Abramovici, Melvin A. Breuer, Arthur D. Friedman,Digital SystemsTestingand Testable Design, Revised Printing, IEEE Press, New York, NY, January, 1998, ISBN:0780310624 3.

List four examples of mixed-signal circuits. 3. 2. Which type of mixedsignalcircuit actsasa volumecontrolfor the cellulartelephoneearpiece? 4. Which type of mixed-signal circuit converts the speaker's voice into digital samples? 5. Which type of mixed-signalcircuit convertsincomingmodulatedvoice datainto digital samples? 6. Which type of digital circuit vocodes the speaker's voice samplesbefore they are passed to the base-bandinterface? 7. Whena PGA is combinedwith a digital logic block to keepa signalat a constantlevel, whatis the combinedcircuit called?

2 Wafer Probers Wafer probers are robotic machines that manipulate wafers as the individual dies are tested by the ATE equipment. The prober moves the wafer underneath a set of tiny electrical probes attachedto a probe card. The probes are connected to the electrical resources of the ATE tester through a probe interface board (PIB). The PIB is a specialized type of DIB board that may be connectedto the probe card through coaxial cables and/or spring-loaded contacts called pogo pins. The PIB and probe card serve the samepurpose for the wafer that the DIB board servesfor the packageddevice.

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